Durostone®
Wave Solder Pallet Material
(data sheet download)
Durostone® wave solder pallet materials have excellent mechanical properties
at elevated temperatures. These products have become the industry standard for
the production of wave solder pallets used in the printed circuit board industry.
Durostone is easier to handle in the production process than other products
used for PCB tooling due to two factors:
1. The density, which helps to reduce the weight of the finished tooling.
2. The glass and resin content, which ensures that the line operators and the
machinists are not subjected to skin irritation alleviating any health &
safety concerns. All materials are dimensionally stable and retain their flatness
through repeated cycling in the PCB assembly process. The low thermal conductivity
of Durostone® ensures optimal thermal distribution across the PCB. The resin
system used in Durostone provides resistance to the chemicals used in fluxes
and also prevents solder pick-up. Can be machined to tight tolerances. Metric
thicknesses 1mm = 0.393"
Wavemax® 5000 - Wave Solder Pallet Material
(data sheet download)
Wavemax 5000 SP525M is non-woven substrate combined with high temperature and
static dissipative epoxy resin. Wavemax (aka Norplex SP525M) has superior machining
properties, and is capable of producing thin walls with high strength for finely
machined parts. It has excellent mechanical strength at elevated temperatures.
The continuous operating temperature is over 200°C. Short excursions
to temperatures approaching 360°C, such as in wave soldering or IR
re-flow, will not adversely affect the life of this material.
CBC - Glastic Engineered Wave Solder Pallet and Circuit
Board Carrier Materials (data
sheet download)
When you need high temperature resistance for lead-free RoHS compliant wave
soldering applications and tight tolerances and structural integrity for circuit
board carriers, Glastic offers the solutions to meet your needs:
Lighter weight than metal or other composite materials. Exceptional dimensional
stability and flatness. Excellent machineability. Exacting thickness tolerances.
High thermal and chemical resistance. Made in the USA, these premium circuit
board carrier materials are available in three popular versions to meet your
assembly needs.
The top-of-the-line grades are available in both non-conductive (CBC) and electrical
static safe semi-conductive (CBC-C) versions. When an optically sense-able solder
pallet is needed, without compromising electric static discharge safety, Glastic
NBC grade is a perfect choice. All three types are made with high-strength advanced
composite materials. Glastic solder pallet materials are lightweight, which
gives them an advantage over aluminum, titanium and other composite materials.
Dimensional stability, flatness, thermal shock resistance and chemical resistance
make them ideal products for the very hostile, lead-free environments presented
in wave solder applications. Each sheet is closely checked for warp, twist,
surface resistivity and other key properties prior to being micro-sanded to
the tightest tolerance control available (+/- 0.002”). Whether you require dedicated
pallets for individual boards or adjustable pallets that can accommodate various
sizes, you can rely on Glastic composites to provide a solution. Glastic’s pallet
carrier material is available in a variety of popular thicknesses to meet your
needs. Standard sheet size is 1m x 2m.
Radian Stainless Stencil Steel
Radian Stencil Steel are produced for the specific intention of being
used in the manufacture of SMT Solder Paste Stencils. The materials are tension
levelled and edge dressed and are 100% inspected for flatness, scratches, dents
and debris. Having worked very closely with our customers over the years we
have developed a complete understanding of the SMT and stencil market that has
become the benchmark for quality.
Features of Radian Stencil Steel: Flatter Harder surface Uniform surface aspect
Uniform grain structure
Advantages of Radian Stencil Steel: Flatter stencils allow for more accurate
printing Harder surface gives a more durable stencil Uniform grain allows for
higher stress relaxation properties Grain structure also contributes to smoother
aperture walls
Benefits of Radian Stencil Steel: More uniform grain structure will improve
registration and print accuracy Increase in surface hardness will increase Mean-Time-Between-Change
Finer grain structure will give better results from Electropolishing and zero
curling when step etching Higher resistance to Thermal shock offers greater
stress relaxation properties, thus stencils that are laser cut or etched will
have more consistent results
